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Shrinkage multi-materials

Let s look at silicone gel, a multi-functional material, for electronic applications. This material has excellent physical properties, typical for organopolysiloxanes and also other unique properties which are derived from the low crosslinking density of the gel. Addition reaction type curing mechanism is used for silicone gels, because it offers excellent thermal stability, low shrinkage and ease of molecular design. [Pg.561]

Dimensional control is one of the major keys to have a high process yields. Even though dimensional stable laminates are selected, the thin flexible materials will have remarkable shrinkages during the multi-layer rigid/flex s multiple thermal processes of the. The correction factors for the each thermal or chemical process should be measured carefully. Appropriate work sizes should be chosen carefully to optimize the process yields. [Pg.1572]


See other pages where Shrinkage multi-materials is mentioned: [Pg.567]    [Pg.216]    [Pg.132]    [Pg.80]    [Pg.178]    [Pg.365]    [Pg.30]    [Pg.258]    [Pg.245]    [Pg.470]    [Pg.71]    [Pg.2077]    [Pg.78]    [Pg.531]    [Pg.59]    [Pg.408]    [Pg.2716]   
See also in sourсe #XX -- [ Pg.216 , Pg.218 , Pg.223 , Pg.232 ]




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Multi-material

Shrinkage

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