Semiconductor processing techniques

Quality. Semiconductor processing techniques enable integration and thus a reduction in the numbers of elements and interconnections, resulting in improved quality. Furthermore, proven batch processes for quality assurance and testing of silicon-based sensors have been adopted from processes for integrated circuits. 

There has been considerable interest in the determination of ions at trace levels as, for example, in applications need high-purity water as in semiconductor processing and the determination of trace anions in amine treated waters. For this investigation, we will define "trace" as determinations at or below 1 pg/1 (ppb) levels. The Semiconductor Equipment and Materials International (SEMI) recommended the use of IC for tracking trace ionic contaminants from 0.025 to 0.5 pg/1 [18]. In addition, the Electric Power Research Institute (EPRI) has established IC as the analytical technique for determining of trace level concentrations of sodium, chloride and sulfate down to 0.25 pg/1 in power plant water [19]. 

However, this article is not intended to provide an exhaustive review of the voluminous literature on the application of surface analytical techniques to semiconductor problems. Numerous reviews have been published which have treated various aspects of these applications (1-jj). This article is intended to give an overview, drawing from more recent publications, of the ways in which surface analysis continues to play a vital role in the development and application of the numerous material technologies involved in semiconductor processes. In addition, the need for further development of surface techniques and a summary of the materials problem that do not lend themselves to the available analytical techniques are described. 

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