Selective dispensing

In surface mounting of components, both solder paste and adhesive need to be dispensed. The solder paste is usually screen printed or stenciled first, followed by selective dispensing of the adhesive between the solder pads. The prime function of... 

Stencil printing is a fast efficient process for long production runs and is widely used in surface mounting of components. In surface mounting, the solder paste is generally dispensed first by stenciling, followed by needle dispensing the adhesive however, these processes may be reversed or both the solder and adhesive can be selectively dispensed by needle. 

Material jetting is the use of inkjet printers or other similar techniques to deposit droplets of build material that are selectively dispensed through a nozzle or orifice to build up a three-dimensional structure. In most cases these droplets are made up of photopolymers or wax-like materials to form parts or investment casting patterns, respectively. These processes are truly 3D-printing machines, as they use inkjet and other printing techniques to build up three-dimensional structures. 

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