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Sample CVD and ALD processes

We turn finally to several examples of CVD and ALD processes that illustrate the issues described above. Many CVD processes take advantage of temperature [Pg.597]

At lower temperatures the exothermic deposition reaction dominates. The temperature gradient in the sealed reactor tube leads to net transport of Si from a source to the substrate. [Pg.599]

A relatively simple but technologically interesting material that can be conveniently deposited by CVD is SiC. SiC is typically produced by reaction of a small organic molecule such as propane (CsHg) with silane (SiH4) in a hydrogen ambient. This reaction has been studied in some detail. For a detailed discussion see, for example. Reference [14]. The reaction runs both forward and in reverse depending upon temperature and H2 partial pressure. [Pg.600]

This can only occur where Si is available as a reactant. An Si02 layer does not react with WFg as it is too stable. Therefore, it makes a good mask. This means that W [Pg.601]

The reaction is strongly catalyzed by the presence of W, thus it proceeds most rapidly where a pre-existing W layer is present. Because it does not require Si reactant from the substrate it proceeds without further consumption of the substrate. [Pg.602]


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