Resin cure kinetics sulfone

The effects of impurities, or synthesis byproducts, and stoichiometry on the cure kinetics of N,N -tetraglycldyl methylene dianiline (TGMDA) resins formulated with dlaminodiphenyl sulfone (DDS) are evaluated using gel permeation chromatography and differential scanning calorimetry. 

The microwave and thermal cure processes for the epoxy-amine systems (epoxy resin diglycidyl ether of bisphenol A, DGEBA) with 4,4 -diaminodiphenyl sulfone (DDS) and 4,4 -diaminodiphenyl methane (DDM) were investigated for 1 1 stoichiometries by using fiber-optic FT-NIR spectroscopy. The kinetic rate parameters for the consumption of amines were determined by a least squares curve fit to a model for epoxy/amine cure. The activation energies for the polymerization of the DGEB A/DDS system were determined for both cure processes and found to be 66 and 69 kJ/mol for the microwave and thermal cure processes, respectively. No evidence was found for any specific effect of the microwave radiation on the rate parameters, and the systems were both found to be characterized by a negative substitution effect [99]. 

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