Properties Cards for MID Processes

Different MID manufacturing processes have different properties profiles. The intrinsic strengths and weaknesses of each process are determined by the underlying technology. The properties cards developed by Peitz describe the characteristics of the individual processes. 

These properties cards are helpful for selecting the best-fit process for the MID basic solution. Direct correlations can be set up between the requirements features of the basic solution and the properties features of the production processes. This is the case, for example with conductor tracking as a requirement feature and 3D design freedom of the conductors as a property feature. Requirements profiles for specific MID can be matched directly to property profiles of particular manufacturing processes in this way. 

This identifies the MID production process best suited to the requirements profile of the basic solution. The features for which requirements are particularly high are naturally those on which attention should focus. The number of MID production processes is limited, so requirements profiles cannot always be satisfied in their entirety. Compromises are often necessary. In some cases, for example, the design of the part has to be altered or the conductor layout modified to soften individual requirements applicable to the production process. 

3D design freedom of the conductors Metallization is possible on all sides, conductor layout is restricted by accessibility for the laser 

Realization of metallized surfaces Considerable complexity Is Involved In plating large surfaces (many parallel passes) 

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