Process Parameters During CMP

3 FACTORS INFLUENCING THE TRIBOLOGY DURING CMP 4.3.1 Process Parameters During CMP 

The slurry acts as a lubricant and coolant at the interface during polishing. The lubricant film separates the sliding surfaces and thus reduces friction 

FIGURE 4.3 Coefficient of friction and real-time acoustic emission at different loads and speeds. 

Another important factor that is often not taken into consideration is the process temperature during polishing. Recent researches [12,13] have elucidated the effect of temperature on the coefficient of friction during both copper and ILD CMP by conducting polishing experiments at different pad and slurry temperatures. Sorooshian et al. [12] have attributed the changes in coefficient of friction to the changes in pad properties, which result in an increase in shear force. Conversely, removal rate, surface chemical analysis. 

FIGURE 4.4 Stribeck curves generated for different slurry flow rates (from Ref 10). 

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