Printing photocured coatings

An advantage of this type of photopolymerizations is that as they are non-radical chain polymerizations, they are insensitive to oxygen. In addition, as the cation is relatively stable, the reaction is able to continue in the dark. Applications of this chemistry may be found in the fields of coatings, adhesives, printing inks, and also for photocurable composites and microelectronic photoresists. 

Photopolymers These are photoinitiated and photo-cross-linked polymers e.g., photoresists, printing inks, can coatings, etc. Fouassier J-P (1995) Photoinitiation, photopolymerization and photocuring. Hanser-Gardner Publications, New York. Leach RH, Pierce RJ, Hickman EP, Mackenzie MJ, Smith HG (eds) (1993) Printing ink manual, 5th edn. Blueprint, New York. 

ED paints may be thermally or photochemically cured for improved performance. None the less, it was some time before serious attempts were made to use ED photocurable films as resists for metal patterning. It had been foreseen that dry-film photoresists, which have been the mainstay of the printed circuit board inner-layer fabrication process for the last two decades, would soon reach their resolution limit and that a process that coated much thinner layers of resist would take over. ED resists that were capable of coating layers up to five times thinner than dry film seemed the natural successors. In 1986 the Rohm and Haas Co. [2] issued a patent describing a photoresist composition for cataphoretic deposition onto copper during the process of forming a printed circuit board. Many other patents in this field, describing both cataphoretic and anaphoretic deposition of a wide variety of resins, have been issued since then. 

Photocuring Furniture coatings, printing plates, dental restorative systems, insulation of electrical conductor wires, volume phase holography... 

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