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Printed wiring board surface finishes

TABLE 8 Printed Wiring Board Surface Finishes Used in Manufacturing Trials... [Pg.676]

Now that Europe s RoHS legislation restricts Pb to a level of less than or equal to 1,000 parts per miUion by weight in electrical and electronic assemblies, there is much more focus on tin whiskers. Traditionally, many electrical components had tin-lead surface finishes, as did printed wiring boards (HASL). In cases where pure tin finishes were used on components, small additions of lead were added. The resulting lead-doped tin lattice imparted some compliance to the structure and rednced the risk of tin whisker formation. For the vast majority of electrical and electronic prodncts, that is no longer an option for many classes of components. [Pg.1054]

L. Mayer and S. Barbieri, Characteristics of Add Copper Sulfate Deposits for Printed Wiring Board Applications, Plating and Surface Finishing, March 1981, pp. 46-49. [Pg.1363]

Surface Finishes for Printed Wiring Boards in NCMS Manufacturing Trials... [Pg.676]

TABLE 9 Surface Mount Components Used in Study of Printed Wiring Board (PWB) Surface Finishes... [Pg.676]

See other pages where Printed wiring board surface finishes is mentioned: [Pg.803]    [Pg.820]    [Pg.803]    [Pg.820]    [Pg.65]    [Pg.111]    [Pg.769]    [Pg.804]    [Pg.83]    [Pg.9]    [Pg.701]   
See also in sourсe #XX -- [ Pg.803 , Pg.804 ]



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