Polyimide nanocomposites resistivity

Figure 2.14. (a) Surface and (b) volume resistivity of the polyimide nanocomposites as a function of nanotube content in the nanocomposites. Reproduced from reference 53 with permission from Elsevier. 

PI nanocomposites have been prepared by various methods with different fillers. The nanocomposites might have many applications starting from barrier and thermal resistance to a compound with low coefficient of thermal expansion (CTE) [154-167]. These hybrid materials show very high thermal and flame retardation as well as barrier resistance and adhesion. Tyan et al. [158] have shown that depending on the structure of the polyimide the properties vary. Chang et al. [159] have also investigated the dependency of the properties on the clay modifiers. 

Polyimides (PI) are widely used in microelectronics and photonics because of their outstanding electrical properties, heat resistance, and chemical stability [10-12], Pl/clay nanocomposites have been reported to reduce the coefficient of thermal expansion, amount of moisture absorption, and dielectric constant for improved performance in these application areas already mentioned [13-22], For example, Yano et al. [13] prepared a PI (pyromellitic anhydride-4,4 -oxydianiline)/clay composite film [(PMDA-ODA)/clay] by solution-mixing of polyamic acid (PAA) and a dimethylacetamide (DMA) dispersion of clay. They used dodecylamine as the clay modifier, and the film showed reduced thermal... 

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