Polishing scratch mechanism

The polishing scratch mechanism in dielectric CMP is illustrated in Figure 1.18. From the top view, an arc shaped chatter-mark is created behind the abrasive contact region because of the maximum shear stress in the tensile region. In this case, the concave side of the arc shape of the micro-scratch will face the direction of travel... 

The absolute value of and Rq depends on the interval length considered for the measurement. This is illustrated by Figure 3.41 for titanium surfaces polished either mechanically or electrochemically [14]. At small interval length the Rq for the electropolished surface is smaller than for the mechanically polished surface, reflecting the absence of polishing scratches. At an interval length exceeding 300 micrometer... 

Figure 4.18 Optical micrographs collected on wear traces obtained in the presence of (A) 1 % Sr octanoate in dodecane and (B) 1 % overbased Ca octanoate in dodecane after ultrasonic cleaning in pentane at the end of tests of 2000 cycles. The total elimination of the antiwear film, in the case of Sr additive, shows that adhesion of the Sr antiwear film is weaker than the Ca one. The presence of polishing scratches on the initial surfaces under the film points out the exceptional efficiency of the additives. (C) Ca octanoate antiwear film extraction by the stress applied using the tip of a mechanical profilometer...

Finally, before the deposition of the SiO 4.5 wt.% P film, the surface of an Al substrate was intentionally scratched by mechanical polishing. The scratches were about 1.5 pm wide, 1 pm deep, and were oriented 45° with respect to the longitudinal axis of the sample. This system (denoted as D), permits analysis of the effect of an interfacial roughness. 

Defining mechanochemistry as the mechanical breakage of intramolecular bonds by external force, Kaupp elucidated the relative merits of grinding, milling, shearing, scratching, polishing, and rapid friction, and differentiated these from the more thermally related processes of... 

Surface roughness of the metal may be degraded by either scratching from the abrasive or by chemical attack. The optimized slurry formulation must maintain a balance between the chemical component and the mechanical component. A polish that is too... 

Mechanical polishing is generally first done with fine emery paper. Care must be taken to work across the lines (scratches) formed on the surface by continual random rotation of the sample. Then alumina powders of different grades (on different felts) or diamond pastes of different grades (on different cloths) are used to remove, as well as possible, the disturbed layer.t A mirror finish should be observed for instance, no trace of the lines due to the polishing should appear when observation is magnified 20 times. 

However, not only the choice but also the pretreatment of the substrate play an essential role for the nucleation rate and the quality of the diamond films obtained. Significantly better results are observed upon mechanically pretreating the surface. A polishing with diamond powder or with another abrasive, for instance, causes many scratches that then constitute preferred nucleation centers. Where diamond grinding powder is employed, the remnant tiny diamond fragments are assumed to serve to the same purpose. This effect can also intentionally be produced by depositing suitable centers of crystallization on the substrate. These include. 

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