Polishing rate, correlation with surface

It is important to understand the adhesion force of particles on polished surfaces, which can be correlated with the polishing and cleaning characteristics of a CMP process. Higher adhesion force often leads to higher polishing rate, higher level of scratches, and greater number of particles left on the polished surface. 

Regardless of its function as an alternate corrosion indicator of Ico , the LPR serves as a useful standalone probe of the chemical component of CMP. Since the faradaic activity of a metal surface proportionally decreases with increasing values of Rp, it is usually possible to establish a direct correlation between the MRRs and Rp as long as the mechanism of material removal is dictated by electrochemical mechanisms. The quality of this correlation can then be used as an empirical measure of the chemical component of CMP. An example of this analysis is shown in Figure 3.10, where the polish rates of TaN measured by CMP in different solutions (Janjam et al., 2010a) are... 

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