Operating Parameters on Sputter Cleaning

A strong magnetic field can focus or confine electrons more effectively, increasing the sputtering rate. Nevertheless, a uniform magnetic field strength near 

The sputtering rate does not change much with the increase of cathode surface area at low system pressure p= lOmtorr). The plasma treatment is localized and effectively confined. However, at a relatively high system pressure (/) = SOmtorr), the sputtering rate is almost zero for the larger cathode. This case reiterates the importance of system pressure in AMT Ar sputtering treatment. 

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