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Ohmic control nonuniform deposition

Mass-transport deposition control occurs when the exchange current density P is high and the limiting current density is low. Ohmic resistance can be a cause of nonuniformity if there is an appreciable difference in solution resistance from the bulk of the solution to peaks or to recesses. Distribution of the current density will be such that ip > i. and peaks will receive a larger amount of deposit than will recesses. Distribution of deposit in the triangular groove under conditions of mass transport and ohmic control nonuniform deposition, with ip > is shown in Figure 10.14. [Pg.192]

The two major causes of uneven current distribution are diffusion and ohmic resistance. Nonuniformity due to diffusion originates from variations in the effective thickness of the diffusion layer 8 over the electrode surface as shown in Figure 10.13. It is seen that 8 is larger at recesses than at peaks. Thus, if the mass-transport process controls the rate of deposition, the current density at peaks ip is larger than that at recesses since the rate of mass transport by convective diffusion is given by... [Pg.192]

Under the conditions shown in Figure 10.14, the roughness of the surface increases. Thus, to get leveling of the surface it is necessary to change from diffusion and ohmic control to activation control. Activation control can result in uniform deposition (ip = iy) or in nonuniform deposition (with i. > ip). In nonuniform deposition with... [Pg.192]


See other pages where Ohmic control nonuniform deposition is mentioned: [Pg.83]    [Pg.493]   
See also in sourсe #XX -- [ Pg.192 ]




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