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Nano copper preparation temperature

Surface improvement is a very important link between preparation and application of nano materials the specific method employed for the surface improvement is closely related to the occasion where the nano material is to be used. For nano copper powder the main problem is its easy oxidation, i.e., it has no anti-oxidation nature at room temperature. The partial replacement of Cu by Ag to transform the nano copper powder into the Cu-Ag double metal powder is one of the most feasible methods for the surface improvement of nano copper, because the nano Cu-Ag double metal can meet the requirement of anti-oxidation at room temperature also the latter can be used in the preparation of electro-conductive materials and electro-conductive rubbers etc. to replace some expensive metals such as silver and palladium. [Pg.297]

With the nano copper produced in the SCISR the Cu-Ag double metal powder is prepared by the replacement reaction with AgN03 as the reactant. The TEM-determined results show that the product of Cu-Ag double metal powder prepared consists of particles sized 5 to 30 nm and their clumps after storage for one month at room temperature no change in the color of the Cu-Ag double metal powder has been found, suggesting the product has anti-oxidation nature at room temperature. [Pg.300]

In Fig. 9.1, the results of in situ time-resolved XRD show diffraction lines for CuO and CeOg in a freshly prepared copper-ceria nano-catalyst. Once the catalyst is exposed to the reactants of the WGS at temperatures above 200 °C, the diffraction lines for CuO disappear and new lines appear for metallic Cu. Significant catalytic activity is... [Pg.467]


See other pages where Nano copper preparation temperature is mentioned: [Pg.288]    [Pg.298]    [Pg.300]    [Pg.156]    [Pg.535]    [Pg.300]    [Pg.535]    [Pg.93]    [Pg.313]    [Pg.4014]    [Pg.519]    [Pg.319]    [Pg.199]    [Pg.200]    [Pg.235]   
See also in sourсe #XX -- [ Pg.293 ]




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