Multilayer printed wiring laminates

To facilitate the many choices of laminates and their associated properties, industry standards groups such as the IPC have defined minimum performance specifications and have issued several specifications to inform the selection process. Some of the most commonly used material specifications are those that deal with laminate,prepreg, and copper foil. IPC lOl, Specification for Base Materials for Rigid and Multilayer Printed Boards, and IPC-4652, Metal Foil for Printed Wiring Applications, are the primary specifications for clad laminates, prepregs, and foils. Another specification, IPC- 4104, Specification for High Density Interconnect (HDI) and Microvia Materials, deals with many of the new materials for HDI, such as epoxy-coated microfoils, as discussed in this chapter. 

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