Moisture wood bonding parameters

As 50% of the success of wood adhesives is in its application parameters, these need to be carefully considered even an excellent wood adhesive will give very poor bonding if the correct applications parameters are not respected. Foremost about these is the wood percentage moisture content. Generally, thermosetting resins for panels are used at moisture contents of 10-12% for particleboard or similar panels and at 7-9% for plywood, with some notable exception such as tannin adhesives, which can reach 25%... 

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