Modulus Spectroscopy Materials analysis

Another possibility of determining the gel point with the help of rheological methods is dynamical mechanical spectroscopy. Analysis of change of dynamic mechanical properties of reactive systems shows that the gel point time may be reached when tan S or loss modulus G" pass a miximum [3,4,13], Some authors proposed to correlate the gel point with the intersection point of the curves of storage and loss moduli, i.e., with the moment at which tan 5 = 1 [14-16], However, theoretical calculations have shown that the intersection point of storage modulus and loss modulus meets the gelation conditions only for a certain law of relaxation behavior of the material and the coincidence erf the moment of equality G = G" with the gel point is a particular case [17]. The variation of the viscosity... 

Thermal analysis techniques are used to study the properties of polymers, blends and composites and to determine the kinetic parameters of their stability and degradation processes.Here the property of a sample is continuously measured as the sample is programmed through a predetermined temperature profile. Among the most common techniques are thermogravimetry (TG) and differential scanning calorimetry (DSC). Dynamic mechanical analysis (DMA) and dielectric spectroscopy are essentially extensions of thermal analysis that can reveal more subtle transitions with temperature as they affect the complex modulus or the dielectric function of the material. 

It is hoped that the more advanced reader will also find this book valuable as a review and summary of the literature on the subject. Of necessity, compromises have been made between depth, breadth of coverage, and reasonable size. Many of the subjects such as mathematical fundamentals, statistical and error analysis, and a number of topics on electrochemical kinetics and the method theory have been exceptionally well covered in the previous manuscripts dedicated to the impedance spectroscopy. Similarly the book has not been able to accommodate discussions on many techniques that are useful but not widely practiced. While certainly not nearly covering the whole breadth of the impedance analysis universe, the manuscript attempts to provide both a convenient source of EK theory and applications, as well as illustrations of applications in areas possibly u amiliar to the reader. The approach is first to review the fundamentals of electrochemical and material transport processes as they are related to the material properties analysis by impedance / modulus / dielectric spectroscopy (Chapter 1), discuss the data representation (Chapter 2) and modeling (Chapter 3) with relevant examples (Chapter 4). Chapter 5 discusses separate components of the impedance circuit, and Chapters 6 and 7 present several typical examples of combining these components into practically encountered complex distributed systems. Chapter 8 is dedicated to the EIS equipment and experimental design. Chapters 9 through 12... 

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