Miniature heat exchanger

Johnston, A. The Chemical Engineer (London) No. 431 (1986) 36. Miniaturized heat exchangers for chemical processing. 

Micro heat exchangers were expected to give enhanced heat transfer in chemical reactions, e.g. in order to control undesired reactions. Wegeng and Ehrfeld attribute the main potential of miniaturized heat exchangers to the minimization of... 

Figure 18. Photographs of a miniature heat exchanger developed for the precooling stage of a helium Joule-Thomson cryocooler. The construction used photoetched stainless steel foil diffusion bonded together [9],...

The use of photoetched stainless steel foil diffusion bonded together was described as one fabrication method currently under study for developing miniature heat exchangers. Very uniform gap spacing is required to maintain uniform flow distribution and high effectiveness in the heat exchanger. Measured effectiveness was lower than the calculated value, which indicates a possible problem with non-uniform flow. 

Miniature Heat Exchanger with Combined Corrosion and Fouling Evaluation... 

Wu PY, Little WA (1984) Measurement of the heat transfer characteristics of gas flow in fine channel heat exchangers used for micro-miniature refrigerators. Cryogenics 23 415 20... 

Micromixing technologies have only recently been applied to the design of miniaturized devices for chemical applications, so called microreactors. The main components of such microreactors are mixers and heat exchangers. 

A few other examples are examined here to illustrate the range of geometries that may exist in optimized heat exchangers for cryocoolers. These examples are for Joule-Thomson cryocoolers, which are easily miniaturized. Table 1 lists the operating conditions and important input parameters for all of... 

In the applications, industrial heat exchanges are mini-and-microscale heat transfers, miniature and micro heat pipes and heat transfer issues in cryogenic catheters are presented. Nanotechnology and heat transfer including heat transfer characteristics of silicon film irradiated by pico to femtosecond lasers are also introduced and discussed. 

Problems of physical limits for miniaturization of electronic devices in integrated circuits are discussed. The quantization of both electrical and thermal conductance in nanostructures is considered and estimated numerically. Problems of heat exchange in nanostructures are also discussed. 

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