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Microstructure grain bridging

Fig. 11. AI2O2—Al TiO typical microstructure showiag grain bridging, B (SEM backscattered electron image).

Figure 14.11 Microstructural design methods to increase fracture toughness in ceramics in the crack wake, (a) Grain bridging (b) Crack-wake dilatants zones, (c) Microcracking. From M. Hoffman, PhD Thesis.

$Figure 14.11 Microstructural design methods to increase fracture toughness in ceramics in the crack wake, (a) Grain bridging (b) Crack-wake dilatants zones, (c) Microcracking. From M. Hoffman, PhD Thesis.$

The microstructural observation on cracked samples shows that three toughening mechanisms, crack deflection, crack bridging and pullout caused by lamellas Ti AIC grains operate both in the monolithic material and in the composite, accounting for the high toughness of the matrix and the composite. [Pg.38]

Tables 9.2 and 9.3 list microstructural characteristics, fracture toughness, densification and annealing conditions, respectively. In Fig. 9.54, crack bridging by large SiC grains is indicated. Recall that crack bridging improves fracture resistance by acting as bridges between opposite faces of a crack and, during the...

$Tables 9.2 and 9.3 list microstructural characteristics, fracture toughness, densification and annealing conditions, respectively. In Fig. 9.54, crack bridging by large SiC grains is indicated. Recall that crack bridging improves fracture resistance by acting as bridges between opposite faces of a crack and, during the...$

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See also in sourсe #XX -- [ Pg.669 , Pg.670 , Pg.671 , Pg.677 ]

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Grain Bridging