Micropatterning and Microfabrication in Atmospheric-Pressure Microdischarges

Direct Micropatterning and Microfabrication in Atmospheric-Pressure Microdischarges 

Microetching, Microdeposition, and Microsurface Modification by Atmospheric-Pressure Microplasma Discharges 

Effective microetching of Si wafers using a microscale RF-ICP discharge was demonstrated by Ichiki, Taura, and Horiike (2004). The miniaturized inductively coupled atmospheric-pressure thermal plasma was generated at very high frequency (100 MHz) in a 1-tmn-diameter discharge tube. The tube was provided by a fine nozzle (100 qm) at one end and a three-tum solenoidal anteima wound around it. A schematic of the microetcher is shown in 

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