Microhotplate and Chip Layout

Two identical polysilicon temperature sensors with a nominal resistance value of 10 kQ are located in the membrane center. One resistor is connected to the temperature controller, the other sensor is totally decoupled from the circuitry. This second temperature sensor can be directly accessed via bond pads in a four-point configuration. It enables an accurate calibration and a verification of the temperature controller 

The packaging strategy presented in Sect. 5.1.6 can be directly applied to this array chip (see Fig. 6.15). The number of necessary bond pads is only five, since this chip takes full advantage of the CMOS-MEMS approach. The number of bondpads 

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