Microelectronic corrosion improvement

The improvement of existing materials as well as the development of new materials is often based on the use of a chemical reaction in which a solid reacts with another solid, a liquid or a gas to form a solid product (an intermetallic, a silicide, an oxide, a salt, etc) at the interface between initial substances. Therefore, kinetics of solid-state formation of chemical compound layers are of interest not only to chemists (researchers and technologists) but also to metal and solid-state physicists, materials scientists, metallurgists, specialists in the field of corrosion, protective coating, welding, soldering and microelectronics. 

TiN. owing to its unique combination of properties, is used extensively as a coating on. structural materials to improve their resistance to heat, wear and corrosion. It is also widely u.sed as a decorative coating on various surfaces. Another important field of application of TiN is in microelectronics, as diffusion barriers in VLSI-MOS integrated circuits. 

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