Microcircuits process integration

DIE separation Refers to the separation of the actual microcircuit chip from the inside of the package. Destructive physical analysis (DPA) Devices are opened and analyzed for process integrity and workmanship. 

With the increase of the degree of integration of microcircuits, the multilevel interconnect technology becomes inevitable for future VLSI manufacture. Polyimide exhibits superior planarity over stepped structures and is expected to be one of the most promising materials for the dielectric insulation of VLSI s. However, since the smallest via holes so far achieved by wet etching is 3 pm (1), the formation of fine via holes by a dry etch process is needed for the application of polyimide to VLSI having fine metal wiring. 

To avoid surface corrosion processes, the microelectronic industry takes three precautions it avoids the use of solvents and reagents that may leave an ionic residue on the microcircuits it encapsulates the integrated circuits and it packages the microcircuits in plastic containers. When used in weapons, in space, or in undersea communi... 

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