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Lead-free vapor phase reflow

Lead-Free Using Vapor Phase Reflow in Lead-Free Processing... [Pg.69]

DURING LEAD-FREE PROCESSING, VAPOR PHASE REFLOW OFFERS THE OPTION TO ELIMINATE THE VARIABLE OF HIGHER TEMPERATURE PROCESSING. [Pg.69]

The focus on equipment optimization included working with equipment suppliers to develop unique systems for rapid changeover. Vapor phase equipment was selected because of its ability to support throughput and upcoming lead-free requirements. Some advantages over convection reflow systems include ... [Pg.69]

The vapor phase lead-free solder process operates at a maximum temperature of 230°C, whereas many convection or IR reflow processes range from 250°C to over 300°C in some zones of the reflow process, depending on the type of PCBAs being processed. Vapor phase is compatible with typical PCB finishes, including HASL, bare copper with OSP, copper/nickel/gold, immersion tin, and immersion silver. [Pg.70]

See other pages where Lead-free vapor phase reflow is mentioned: [Pg.920]    [Pg.72]    [Pg.36]    [Pg.525]   
See also in sourсe #XX -- [ Pg.69 , Pg.70 , Pg.71 , Pg.72 ]



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