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Lap grinding

ELID-lap grinding is a machining process that employs constant pressure and uses metal-bonded abrasive wheel with ELID. It produces better results for both surface roughness and flatness as compared to other grinding... [Pg.222]

ELID-lap grinding of silicon with JK 4000 wheel outputs a mirror-like finish at roughness of 3.8 nm, as compared with 7.4 nm roughness outputted by a conventional lap-grinding. [Pg.223]

ELID-lap grinding of tungsten with JIS 4000 wheel is more stable than conventional lap-grinding from the viewpoint of the stability of the removal rate value (for an 80 min period). [Pg.223]

Principle of ELID-lap grinding. (From Itoh, N., Ohmori, H., Moryiasu, S., Kasai, T., Karaky-Doy, T., and Bandyopadhyay, B.P., Int J Mach Tools Manuf, 38, 747,1998. With permission.)... [Pg.223]

ELID-lap grinding of silicon was achieved in a brittle-fracture mode for JIS 1200 and down and in a ductile mode for JIS 4000 and up. [Pg.224]

Material removal rate results are preser ted in Figure 9.19. ELID-lap grinding using the JIS 3,000,000 metal resin bond wheel produced very good ground surfaces of PV 2.8 mn for silicon and PV 2.5 nm for glass. [Pg.225]

Mechanical surface preparation shall be performed by wire brushing, grinding, buffing, and polishing when required, to remove harmful defects such as fissures, pits, gouges, folds, laps, or oxides. [Pg.59]

Finishing by cutting, grinding, lapping, polishing, drilling for precision parts with optimised surfaces. [Pg.79]

From the viewpoint of the mechanical characteristics, glass and silicon resemble each other. They have a similar mechanical hardness, are brittle as they lack plasticity and are thus prone to fracture. Of the standard precision engineering procedures available for shaping, only those that do not use a geometrically defined cutter can be used, such as grinding and lapping. Microengineering techniques are much more efficient, but they do prove difficult for deeper structures. [Pg.24]


See other pages where Lap grinding is mentioned: [Pg.22]    [Pg.94]    [Pg.1440]    [Pg.483]    [Pg.25]    [Pg.203]    [Pg.218]    [Pg.222]    [Pg.223]    [Pg.224]    [Pg.224]    [Pg.224]    [Pg.224]    [Pg.259]    [Pg.55]    [Pg.55]    [Pg.22]    [Pg.94]    [Pg.1440]    [Pg.483]    [Pg.25]    [Pg.203]    [Pg.218]    [Pg.222]    [Pg.223]    [Pg.224]    [Pg.224]    [Pg.224]    [Pg.224]    [Pg.259]    [Pg.55]    [Pg.55]    [Pg.11]    [Pg.252]    [Pg.194]    [Pg.443]    [Pg.469]    [Pg.314]    [Pg.528]    [Pg.532]    [Pg.532]    [Pg.93]    [Pg.27]    [Pg.28]    [Pg.46]    [Pg.186]    [Pg.443]    [Pg.469]    [Pg.255]    [Pg.255]    [Pg.119]    [Pg.524]    [Pg.194]    [Pg.216]   
See also in sourсe #XX -- [ Pg.222 , Pg.223 , Pg.224 ]




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