Kovar

Kopp s rule Kosher glycerin Kotulskite Kovar... 

In appUcations in which electrical conductivity is required, metals, copper, tungsten, molybdenum, and Kovar [12606-16-5] are the preferred chip-carrier materials. Metals have exceUent thermal conductivities. Tables 2 and 3 Ust the various materials used for substrates, along with their mechanical, electrical, and thermal properties. 

Maximum use temperatures exceed 1000°C except for Si02 (>800° C) melting points range from 1450°C (Kovar) to 3660°C (tungsten). 

M. Bohdanecky and J. Kovar, Viscosity of Polymer Solutions, Elsevier, Amsterdam, the Netherlands, 1982. 

Kovar Advance Monel Hastelloy A Inconel Nicbrome V... 

CCC3654 S. Pavelka and J. Kovar, Colleet. Czeeh. Chem. Commun., 41, 3654... 

Crystalline films of TiB2 obtained by CVD are used at lower temperatures as protective coatings. The interaction of these films with various substrates is studied" and desirable properties of the substrate in cases when the coating is deposited according to Eq. (a) are formulated. Substances meeting the requirements in this respect are W, Ta, Mo, WC, TiC, graphite, Fe-Ni-Co-Mn alloy (Kovar) and some high-chrome steels. 

Puskas, J.E., Antony, P., Paulo, C., Kwon, J., Kovar, M., Norton, P., and Altstadt, V. Macromolecular engineering via carbocationic polymerization Branched and hyperbranched stmctures, block copolymers and nanostructures, Macromol. Mater. Eng., 286, 565-582, 2001. 

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