Kinetics electrodeposition, additive effect

There are four types of fundamental subjects involved in the process represented by Eq. (1.1) (1) metal-solution interface as the locus of the deposition process, (2) kinetics and mechanism of the deposition process, (3) nucleation and growth processes of the metal lattice (M a[tice), and (4) structure and properties of the deposits. The material in this book is arranged according to these four fundamental issues. We start by considering the basic components of an electrochemical cell for deposition in the first three chapters. Chapter 2 treats water and ionic solutions Chapter 3, metal and metal surfaces and Chapter 4, the metal-solution interface. In Chapter 5 we discuss the potential difference across an interface. Chapter 6 contains presentation of the kinetics and mechanisms of electrodeposition. Nucleation and growth of thin films and formation of the bulk phase are treated in Chapter 7. Electroless deposition and deposition by displacement are the subject of Chapters 8 and 9, respectively. Chapter 10 contains discussion on the effects of additives in the deposition and nucleation and growth processes. Simultaneous deposition of two or more metals, alloy deposition, is discussed in Chapter 11. The manner in which... 

He, Y., Braatz, R. and Alkire, R. (2007) Effect of Additives on Shape Evolution during Electrodeposition. I. Multiscale Simulation with Dynamically Coupled Kinetic Monte Carlo and Moving-Boundary Finite-Volume Codes. /. Electrochem. Soc., 154, D230-D240. 

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