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Interfacial adhesion strength

Stafford CM, Kim JH, Kawaguchi D, Royston G, Chiang MYM (2006) Probing the interfacial adhesion strength in compositional libraries of epoxy films. Mater Res Soc Symp Proc 894 129-137... [Pg.104]

It has been well known that weak interfaces between the inorganic fillers and the organic matrix reduce the mechanical strength of bone cement [38,40,44,45]. The interfacial adhesion strength can be enhanced by plasma treatment, which is generally due to the improved wettability and possibly to the chemical bonds between the filler and the resin [46,47]. Especially in acrylic bone cement, chemical bonds may have an important role in improving the mechanical strength by the plasma treatment. [Pg.652]

The interaction of materials at the interface is integral to composite performance, and this can be affected by the tissue response in various ways, such as filling and swelling of interfacial voids with fluid and fibrous tissue, altering the interfacial adhesion strength between matrix and reinforcement, and delamination of laminate composites. Such effects can lead to failure of a composite, particularly in structural applications. [Pg.299]

Silane Coated Fibers/Epoxy Resin Interfacial Adhesion Strength... [Pg.153]

Wan Y.Z., Wang Y.L., Li Q.Y., Dong X.H., Influence of surface treatment of carbon fibers on interfacial adhesion strength and mechanical properties of PLA-based composites, J. Appl. Polym. Sci., 80, 2001, 367-376. [Pg.450]

Amorphous PA (80)/SAN (20)/SMA Morphology/mechanical properties/ interfacial adhesion strength measured using an asymmetric double cantilever beam fracture test Cho et al. 1997, 1998... [Pg.576]

The thermodynamic compatibility between the rubber and matrix polymers. A high inherent compatibility needs no compatibilizer, but those with low inherent compatibility (e.g., NBR rubber/PP) will need compatibilizers to stabilize the interface and improve interfacial adhesion strength. [Pg.1792]

There still remain several problems to be solved using AE we can detect in-line filament breakage during the drawing process and observe the interfacial adhesive strength using AE. In the future, we expect that more experience and know-how associated with AE will be accumulated. [Pg.260]

Composite strength increases with decrease in L, that is, increase in interfacial adhesion strength x by virtue of the fundamental relationship associated with the well known Kelley-Tyson expression (8) based on a shear-lag theory for metal filaments ... [Pg.426]

A urea-mediated mineralization technique was developed to enable the formation of pHEMA-based hydrogel-calcium phosphate composites with excellent polymer-mineral interfacial adhesion strength that is desirable for bone mimics. This mineralization method was also applied to generate more sophisticated composites containing functional hydrogels that possess anionic groups mimicking the extracellular matrix proteins in bone. [Pg.96]

Figure 4. A urea mediated mineralization process leads to high-affinity growth of CP on pHEMA-based hydrogel copolymers displaying various anionic residues. Hydrogels mineralized here were pHEMA with 5% Glu-MA (A), 5% Gly-MA (B) and 5% Ser-MA (C). Note that the deliberate fracturing of the composite (B) did not lead to delamination of any circular CP domains, suggesting an excellent gel-mineral interfacial adhesion strength. Figure 4. A urea mediated mineralization process leads to high-affinity growth of CP on pHEMA-based hydrogel copolymers displaying various anionic residues. Hydrogels mineralized here were pHEMA with 5% Glu-MA (A), 5% Gly-MA (B) and 5% Ser-MA (C). Note that the deliberate fracturing of the composite (B) did not lead to delamination of any circular CP domains, suggesting an excellent gel-mineral interfacial adhesion strength.
Measurement of coating fracture toughness and interfacial adhesion strength... [Pg.311]

The compressive forces acting to maintain contact among the conductive components are partly due to curing shrinkage achieved when curing the polymeric matrix of ACAs. Both the cohesive strength of the adhesive matrix and the interfacial adhesion strength between the adhesive matrix and the chip and chip carrier must be sufficient to maintain the compressive force. However, the... [Pg.742]

Decreases interfacial adhesion strength and causes delamination... [Pg.744]

Film-substrate interfacial adhesion strength was evaluated by a T-peel test at a peeling rate of 5 mm/min using an Instron 4466 universal testing machine. Grip distance was 23 mm. [Pg.2025]


See other pages where Interfacial adhesion strength is mentioned: [Pg.469]    [Pg.180]    [Pg.92]    [Pg.59]    [Pg.65]    [Pg.65]    [Pg.67]    [Pg.70]    [Pg.717]    [Pg.215]    [Pg.98]    [Pg.239]    [Pg.96]    [Pg.911]    [Pg.224]    [Pg.1780]    [Pg.311]    [Pg.312]    [Pg.147]    [Pg.107]    [Pg.626]    [Pg.160]    [Pg.238]    [Pg.280]    [Pg.816]    [Pg.2025]    [Pg.2996]   
See also in sourсe #XX -- [ Pg.65 , Pg.66 , Pg.117 ]

See also in sourсe #XX -- [ Pg.311 ]




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