Integrated circuits manufacturing methods

It may be considered a fortunate coincidence that this book is published at the time of the introduction of copper interconnection technology in the microelectronics industry. In 1998 the major electronic manufacturers of integrated circuits (ICs) are switching from aluminum conductors produced by physical methods (evaporation) to copper conductors manufactured by electrochemical methods (electrodeposition). This revolutionary change from physical to electrochemical techniques in the production of microconductors on silicon is bound to generate an increased interest and an urgent need for familiarity with the fundamentals of electrochemical deposition. This book should be of great help in this crucial time. 

The chemical modification of surfaces and films i essential in the manufacture of integrated circuits. Patterns and material must be transferred to substrate surfaces and removed from them. As the dimensions of advanced electronic devices shrink to the submicron and molecular scale, properties of the processing techniques become increasingly critical. Characteristics such as low temperatures, low levels of induced dam. ge and contamination, and molecular scale selectivity and controllabilit] are essential. The use of radiation-induced chemistry is desirable if it can be conducted at lower temperatures and with smaller levels of damage and contamination than particle impact and thermal methods. 

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