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Impact of Nanotopography on CMP

Pad conforms around nanotopography variations and polishes uniformly [Pg.114]

Pad bridges across nanotopography down areas and preferentially thins surface films in raised nanotopography areas [Pg.114]

FIGURE 5.4 (See color insert) Basic concepts of soft and hard polishing pads. [Pg.114]

FIGURE 5.5 Basic concepts of soft (left) and hard (right) pohshing pads. [Pg.115]

Wafer Mounting Deformed Wafer After Polish [Pg.116]

See other pages where Impact of Nanotopography on CMP is mentioned: [Pg.114]