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Surface coverage hydrogen evolution

Figure 3.16 Volcano plot for the hydrogen evolution reaction (HER) for various pure metals and metal overlayers. Values are calculated at 1 barof H2 (298K) and at a surface hydrogen coverage of either 0.25 or 0.33 ML. The two curved lines correspond to the model (3.24), (3.25) transfer coefficients (not included in the indicated equations) of 0.5 and 1.0, respectively, have also been added to the model predictions in the figure. The current values for specific metals are taken from experimental data on polycrystalline pure metals, single-crystal pure metals, and single-crystal Pd overlayers on various substrates. Adapted from [Greeley et al., 2006a] see this reference for more details. Figure 3.16 Volcano plot for the hydrogen evolution reaction (HER) for various pure metals and metal overlayers. Values are calculated at 1 barof H2 (298K) and at a surface hydrogen coverage of either 0.25 or 0.33 ML. The two curved lines correspond to the model (3.24), (3.25) transfer coefficients (not included in the indicated equations) of 0.5 and 1.0, respectively, have also been added to the model predictions in the figure. The current values for specific metals are taken from experimental data on polycrystalline pure metals, single-crystal pure metals, and single-crystal Pd overlayers on various substrates. Adapted from [Greeley et al., 2006a] see this reference for more details.
Figure 6.3 shows the effect of different metal deposits (as islands equivalent to a few monolayers with about 90% surface coverage) on the photocurrent ofThe shift of the i-V curve from that of bare material is due to the catalytic effect of the metal on hydrogen evolution. For a metal deposit the photocurrent is parallel to the exchange current density for the dark evolution of H2 Pt, as a catalyst, has the highest exchange current whereas Pb, as an inhibitor, has a very low exchange current. [Pg.240]

The electroless deposition of metals on a silicon surface in solutions is a corrosion process with a simultaneous metal deposition and oxidation/dissolution of silicon. The rate of deposition is determined by the reduction kinetics of the metals and by the anodic dissolution kinetics of silicon. The deposition process is complicated not only by the coupled anodic and cathodic reactions but also by the fact that as deposition proceeds, the effective surface areas for the anodic and cathodic reactions change. This is due to the gradual coverage of the metal deposits on the surface and may also be due to the formation of a silicon oxide film which passivates the surface. In addition, the metal deposits can act as either a catalyst or an inhibitor for hydrogen evolution. Furthermore, the dissolution of silicon may significantly change the surface morphology. [Pg.246]


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