High-density polyethylene/epoxy polymer

The matrix material used in polymer-based composites can either be thermoset (epoxies, phenolics) or thermoplastic resins (low density polyethylene, high density polyethylene, polypropylene, nylon, acrylics). The filler or reinforcing agent can be chosen according to the desired properties. The properties of polymer matrix composites are determined by properties, orientation and concentration of fibers and properties of matrix. 

Lu JK, Ke YC, Qi ZN, Yi XS (2001) Studies of intercalation and exfoliation behavior of organoclays in epoxy resin. J Poym Sci Part B Polym Phys 39 115-120 Lotti C, Isaac CS, Branciforti MC, Alves RMV, Liberman S, Bretas RES (2008) Rheological, mechanical and transport properties of blown films of high density polyethylene nanocomposites. Eur Polym J 44 1346-1357... 

The second generation of polymers was introduced during 1950—65 and includes a number of engineering plastics such as high-density polyethylene, isotactic polypropylene, polycarbonates, polyurethanes, epoxy resins, polysulphones and aromatic polyesters, also used for films and fibres. New rubber materials, acrylic fibres made of polyacrylonitrile and latex paint were also introduced. 

Among the available scientific literatme on the creep response of PNCs [15-43], the majority of papers are focused on the effect of 1-D layered nanofillers of the creep behavior of polymers such as poly (ethylene oxide) (PEO) [15], poly (ethylene terephthalate) (PET) [18], ethylene propylene rubber (EPR) [17], polypropylene [24], nyloii-66 (PA66) [19], nylou-6 (PAG) [22,23], high density polyethylene (HDPE) [21,38,44], poly(ethylene-co-acryhc acid) copolymer [26], epoxy resin (EP) [28], polystyrene (PS) [29], polymethane (PU) [30], and polystyrene-6/oc/5-polybutadiene-6ZocAvpolystyrene triblock copolymer (SBS) [37]. 

The most popular polymers used to fabricate lab-on-a-chip structures are polyfdi-methylsiloxane) (PDMS), polyfmethyl methacrylate) (PMMA), high-density polyethylene, low-density polyethylene, polyamide 6, and the epoxy-based photoresist SU-8 (Becker, 2002). Particularly, PDMS has been widely reported for miCTofluidic systems because it has many favorable properties for prototypes fabrication the material is inexpensive, optically transparent to visible Ught, which makes it compatible with optical detection systems, and also biocompatible its molding procedure is safe and easy to learn and its flexibility allows the integration of elastomeric actuators and optical elements into devices. 

The heat distortion temperature at 1.80 Mpa is the temperature that causes a beam loaded to 1.80 to deflect by 0.3 mm. If the heat distortion temperature is lower than the ambient temperature, -20 C is given. Polymers such as low-density polyethylene, styrene ethylene-butene terpolymer, ethylene-vinyl acetate copolymer, polyurethane, and plasticized polyvinyl chloride distort at temperatures below <50°C, whereas others, such as epoxies, polyether ether ketone, polydiallylphthalate, polydiallyl isophthalate, polycarbonate, alkyd resins, phenol formaldehyde, polymide 6,10 polyimide, poly-etherimides, polyphenylene sulfide, polyethersulfone, polysulfonates, and silicones, have remaikably high distortion temperatures in the range of 150°C to >300 C. Thermomechanical analysis has been used to determine the deflection temperature of polymers and sample loading forces (i.e., plots of temperature vs. flexure). 

Figure 8.14 The dependences of free volume microvoid diameter on epoxy polymer contents c p for HDPE/EP nanocomposites. The calculation of d according to Equation 8.13 for oxygen (1) and nitrogen (2) and d according to Equation 8.15 (3). The horizontal dashed lines indicate experimental values of for polyethylenes of high (4) and low (5) density [40]...

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