Grinding Using Abrasive Pencils and Wheels

Dicing technology is not only a technique to separate silicon wafers into individual chips, it is also possible to produce mechanical function components, e.g. resonators [160]. 

In the case of surface grinding the material is removed by the diamond grains at the periphery of the grinding wheel, which is reciprocating rapidly over the workpiece as it is gradually lowered to the final depth of the cut. 

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