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Grain boundary character distribution

H. Li, F. Czerwinski, J.A. Szpunar. The role of oxide grain boundary character distribution in nickel oxidation kinetics // Defect Diffusion Forum.- 2001.- V. 194-199.-P.1683-1688. [Pg.294]

R. Ishibashi, T. Horiuchi, J. Kuniya, M. Yamamoto, S. Tsurekawa, H. Kokawa, T. Watanabe, T. Shoji, Effect of grain boundary character distribution on stress corrosion cracking behavior in austenitic stairUess steels. Mater. Sci. Forum 475-479 (2005) 3863—3866. [Pg.445]

M. Shimada, H. Kokawa, ZJ. Wang, Y.S. Sato, I. Karibe, Optimization of grain boundary character distribution for intergranular corrosion resistant 304 stainless steel by twin-induced grain boundary engineering, Acta Mater. 50 (2002) 2331—2341. [Pg.445]

T. Watanabe, Y. Suzuki, S. Tanii and H. Oikawa, The Effect of Magnetic Annealing on Recrystallization and Grain Boundary Character Distribution (GBCD) in Iron-Cobalt Alloy Polyciystals, Phil. Mag. Letters, 62,9-17 (1990). [Pg.336]

The nature of the bonding between Si and W has been studied by Azizan et al.216. They found that the Si atoms had a charge loss of about 0.1-0.2 electron. This indicates that the bonding between Si and W has a strong covalent character. No indication can be found in the literature about the state of the excess Si in the as-deposited films. The question of whether it has a uniform bulk distribution or exists as a precipitate at the grain boundaries remains unanswered. [Pg.190]


See other pages where Grain boundary character distribution is mentioned: [Pg.357]    [Pg.399]    [Pg.233]    [Pg.259]    [Pg.329]    [Pg.331]    [Pg.332]    [Pg.357]    [Pg.399]    [Pg.233]    [Pg.259]    [Pg.329]    [Pg.331]    [Pg.332]    [Pg.350]    [Pg.350]    [Pg.203]    [Pg.808]    [Pg.492]    [Pg.493]    [Pg.361]    [Pg.2051]    [Pg.724]   


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