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Gold interface with nickel oxide

Generally, having a nonsolder surface finish to bond a conductive adhesive improves contact resistance [49]. For example, conductive adhesives perform well with palladium-based terminated components. Lead-free board finishes such as nickel/gold and copper/palladium have been evaluated. Failures at the interface between component terminations and conductive adhesives is a typical failure mode observed in durabiUty tests, and also the cause of an increase in electrical resistance. Oxidation and corrosion of Sn-Pb finishes take place at the interface [21]. [Pg.26]

See other pages where Gold interface with nickel oxide is mentioned: [Pg.256]    [Pg.256]    [Pg.507]    [Pg.340]    [Pg.439]    [Pg.208]    [Pg.69]    [Pg.208]    [Pg.87]    [Pg.488]    [Pg.38]   
See also in sourсe #XX -- [ Pg.367 ]



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Gold oxide

Nickel oxidations with

Nickel oxide

Nickel oxide oxidation

Nickelic oxide

Nickelous oxide

With nickel

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