Gold between flat plates

We saw in Section 3.1 that CEC consists in substituting the anode platinum wire by a gold him mechanically squeezed between two flat insulahng substrates and that the physical conflnement favours a quasi-2D gro vth. We can here raise the question, what would happen if we directly use free large surface anodes as substrates We next see two examples, using gold plates and silicon wafers as electrodes. 

Often, detector arrays are adhesively mounted in leadless ceramic chip carriers (LCCs). Electrical leads are plated on the surface of the LCC and mate with matching spring-loaded, gold-plated contacts in a socket that can be mounted in a dewar, while allowing the flat back of the LCC to be pressed against the dewar s cold surface. In this case, a 3-5 mil (0.003-0.005 in.) thick sheet of indium is placed between the... 

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