Glue metals titanium

The BLM layer uses a glue layer of chromium or titanium. These metals stick well to other metals and most dielectrics, but they are not solderable. Copper, nickel, and silver have been used as the solder-wetting layer for BLM in appHcations involving 95% lead—5% tin solders. Gold is commonly used as the oxidation layer on account of its resistance to oxidation and its excellent solderabiUty. 

If a single metal film is deposited on an oxide, the sheet resistance measurement results can by easily interpreted and converted to the thickness. In practice, however, this is not usually the case. For example, in W CVD, the tungsten is not directly deposited on oxide due to high residual stress and unreliable adhesion. A titanium (Ti) layer must be first deposited as a glue layer. In addition, to prevent the fluorine in the CVD-precursor WFg from directly reacting with Ti (a strong catalytic reaction will occur), a barrier layer of titanium nitride (TiN) must be deposited on top of the Ti. As a result, we have a trilayer film of W on TiN on Ti on oxide, as shown schematically in Fig. 21. This poses some problems in accuracy in the four-point probe measurements. Based on the resistivities in Table VI, the... 

Belt conveyor dryers yeast, charcoal briquettes, synthetic rubber, catalysts, soap, glue, silica gel, titanium dioxide, urea formaldehyde, clays, white lead, chrome yellow, and metallic stearates... 

Wooden airframes have historically been bonded, originally with glues such as casein or synthetic urea-formaldehyde systems, but today most aerospace structures are made from fibre composites (glass fibre and carbon fibre, predominantly) and metals (mostly aluminium but also titanium). Adhesives are well suited for joining composite materials since the need to drill holes through the composite can be avoided and, in some cases, the... 

Inorganic (non-polymer) basecoats can provide layers to aid in adhesion (adhesion layer or glue layer) of a film to a surface. For example, in the Ti-Au metallization of oxides, the titanium adhesion layer reacts with the oxide to form a good chemical bond and the gold alloys with the titanium. The layers may also be used to prevent interdiffusion (diffusion barrier) between subsequent layers and the substrate. For example, the electrically conductive compound TiN is used as a barrier layer between the aluminum metallization and the silicon in semiconductor device manufacturing. 

Glue layer (adhesion) An intermediate layer between the film and the substrate used to increase adhesion. Also called a bond coat or tie layer. Example The titanium layer in a titanium-gold metallization on an oxide. The titanium chemically reacts with the oxide and alloys with the gold. 

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