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Functions of Ceramic Substrate

The fimction of the substrate is to provide the base onto which thin-film circuits and/or thick-film circuits, which make up the electrical circuits, are fabricated and various multilayer films are deposited. In addition, the substrate provides the necessary mechanical support and rigidity needed to produce a reliable functional circuit. It must have adequate thermal management ability to ensure proper temperature operation, and it must possess a proper electrical insulation to withstand circuit voltages without breakdown. One can think of the substrate as the foimdation on which the circuit traces and components are mounted and supported. Ceramic materials are often used for thin- and thick-film applications, because ceramics have high thermal conductivity, good chemical stability, and are also resistant to thermal and mechanical shock [4]. [Pg.3]

Characteristics Thick Film Thin Film Multilayer Ceramic Direct Bonded Copper [Pg.4]

Source Imhof, H. and Schless, T., 2004 IMAPS-CII/NEMI Technology Roadmaps Intercon-nection Substrates — Ceramic, January 2005, http //www.imaps.org/cii/ cii roadmap 2004.pdf. [Pg.4]


See other pages where Functions of Ceramic Substrate is mentioned: [Pg.3]   


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