Films percent moisture absorption

The dielectric constant of LCP films is typically 2.7 to 3.0, making them attractive for high speed electronic circuit substrates. Tlie dielectric strength of over 7,000V per mil combined with very low moisture absorption (less than 0.2 percent by weight) meets requirements for electric wire and cable insulation. 

A comparison of these base materials is shown in Table 63.8. Although these new polyimide materials have lower moisture absorption and CTEs than traditional polyimide films, their dimensional change is still not zero. In addition, process variations of 0.02 to 0.05 percent are common from batch to batch during film production. 

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