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Evaporative loss, spin coating

Figure 15. A typical thermogravimetric analysis (TGA) trace of a polymer resist that has been spin-coated and NOT prebaked. The small weight loss at low temperature is due to solvent evaporation and the high temperature weight loss is due to thermal decomposition. Figure 15. A typical thermogravimetric analysis (TGA) trace of a polymer resist that has been spin-coated and NOT prebaked. The small weight loss at low temperature is due to solvent evaporation and the high temperature weight loss is due to thermal decomposition.

See other pages where Evaporative loss, spin coating is mentioned: [Pg.64]    [Pg.363]    [Pg.365]    [Pg.36]    [Pg.441]    [Pg.1818]    [Pg.73]    [Pg.480]    [Pg.645]    [Pg.405]    [Pg.1832]    [Pg.177]    [Pg.505]    [Pg.172]    [Pg.307]    [Pg.218]    [Pg.171]   


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