Electronics adhesives cyanate ester resins

The basic chemical reactions, used to synthesize monomer and polymer resins and the chemistry involved in the use of curing agents to polymerize the resins, have been extensively studied and are well documented. This section serves as a summary only of those polymers that are primarily used in adhesives formulations for electronic applications. Among these polymers are the epoxies, silicones, polyurethanes, polyimides, acrylates, cyanate esters, and cyclo-olefins. Further technical detail for these polymers maybe acquired through literature searches in the transactions of the American Chemical Society (Polymer Group), Society of Plastics Engineers (SPE), and the Society for the Advancement of Materials and Process Engineers (SAMPE). 

Similarities to epoxy resin include no volatile polymerization byproducts stable B-stage resins possible low shrinkage, high adhesion and void free structures. High purity makes cyanate esters very attractive for use in electronic applications. The performance of bisphenol A dicyanate resins in printed wiring board laminates was described by Weirauch et al(4). Mobay Chemical (and Bayer) introduced products of this type for PWB applications in the United States in 1976-78. These "Triazine A resins were not commercially successful and were withdrawn from the market about 1979. 

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