Electron beam curable formulations

Formulation details are then presented in Chapters 11 through 14 for the various possible forms of epoxy adhesive systems room temperature and elevated-temperature curing liquids, pastes, and solids. The more or less unconventional forms of epoxy adhesives are also identified and discussed, since these are now achieving prominence in industry. These include uv and electron beam radiation curable, waterborne systems, and epoxy adhesives capable of curing via the indirect application of heat or energy. 

Free-radical, radiation-curable systems generally consist of monomers, oligomers, photoactivators, other resins, and fillers or tackifiers. An ultraviolet source or electron-beam generator is used to cure the systems. As an illustration Stueben (37) describes a typical UV-cured PSA system containing acrylates and polyvinyl ether. McGinniss (38) discusses formulation design related to UV-curable systems. The cationic photoinitiators are shown in Fig. 1. 

The papers presented in the following chapters represent advances in pressure sensitive adhesives (ultraviolet light activated acrylate monomer - low Tg polyether formulations) photoinitiated cationic polymerization (light activated aryliodonium and arylsulfonium salts of lewis acids in epoxy resin formulations) polymer and formulation design criteria for radiation curable adhesives radiation curable composites (dynamic thermal analysis characterization of electron beam cured... 

Lower VOC Radiation-Cured High Solids Coatings Radiation-curable coatings include high-solids materials that are formulated to be cured by ultraviolet (UV) and electron beam (EB) techniques. While their current use is at a much lower level than powder... 

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