ELECTROLYTIC AND ELECTROLESS METAL PLATING

Hepel et al. [534] comparatively studied electroplating of Cu and Ni on doped and undoped P(Py)/Au and Au-only substrates. They interestingly found that electroplating rates were significantly enhanced at the CP substrates as compared to the Au-only substrates. They also found, expectedly, that the rates were higher on the 

Other electroless and electrolytic metal plating applications using CPs have been described in several patents [1006-1010]. For example, Sonnenberg et al. [1008] describe a process for electroplating a nonconducting substrate via formation of a film of a CP followed by electrodeposition of a metal. The CP film is deposited from an aqueous suspension of the CP containing an additional polymeric stabilizer. Other patents have related to printed circuit board applications [1011]. 

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All books, reviews, and entries on CPs describe the potential applications. Chandrasekhar and others ° have reviewed in comprehensive fashion the applications of CPs, including batteries sensors electro-optic and optical devices microwave- and conductivity-based technologies electrochromic devices electrochemomechanical and chemomechanical devices corrosion protection semiconductor, lithography, and electrically related applications— photovoltaics, heterojunction, and photoelectrochemical cells capacitors electrolytic and electroless metal plating CP-based molecular electronic devices catalysis and delivery of drugs and chemicals membranes and LEDs. 

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