Electroless plating open-circuit conditions

Electroless Ni-P Plating under Open-Circuit Conditions.456... 

It should be noted that such a stoichiometry of the phosphorus formation reaction during electroless Ni-P deposition was confirmed by using analytical methods to determine the amounts of Ni and P deposited, the overall amount of hypophosphite used, and the isotopic composition of the evolved gas, which allows to quantify the contribution of reaction (19.12) under these conditions [78,79]. Therefore, anodic partial current is equal to the sum of cathodic currents during electroless Ni-P plating under open-circuit conditions ... 

Online mass spectrometry data listed in Table 19.1 show decrease in the deuterium content in the evolving gas from 36 mol% in Ni(II)-free solution to 5-10 mol% in the presence of Ni(II) under open-circuit conditions. This is in accordance with the literature data of mass spectrometric analysis of the isotopic composition of the gas evolved in various electroless plating solutions [64,65] and... 

Presuming the electrochemical mechanism electroless copper plating [19], namely, the catalytic reduction of Cu(II) ions by formaldehyde, the partial reactions occurring at equal rates under open-circuit conditions could be written (using the deuterium tracer to specify the origin of hydrogen) in a simplified form as follows ... 

Similarly, partial reaction currents in electroless copper-plating solution can be extracted using electrochemical quartz crystal microgravimetry (EQCM) to in situ monitor the rate of copper deposition under open-circuit conditions and as a function of the electrode potential... 

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