Electroless palladium plating solution composition

TABLE 25.2 Composition of a Typical Electroless Palladium Plating Solution... 

Individual deposition of the Pd and Ag was also undertaken using an electroless method. By plating each metal individually the process can be controlled to obtain a range of different metal ratios. Again, the compositions of the plating solutions and the deposition methodology have been detailed elsewhere (Brown et al., 2010 Wu et al., 2010b). The components of the solutions were the same as the co-deposition solutions except for palladium where a chloride salt was used in place of the nitrate. Membranes that were coated with Pd only were used to compare with the bimetallic sample. Samples were also plated with Pd then sequentially with Ag as comparisons for the co-deposited samples. 

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