Electrodeposition on Native Substrate

In industrial applications of metal deposition a metal M is deposited either on the native metal substrate M or on a foreign metal substrate S. As an example of the former, Cu is electrodeposited on a Cu substrate formed by electroless Cu deposition on an activated nonconductor in the fabrication of printed circuit boards. As an example of the latter, Ni is electrodeposited on Cu in the fabrication of contact pads in the electronics industry. 

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