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Electrical chemical mechanical polish method

Method (10) is an ECMP (electrical chemical mechanical polish method). Electricity is applied to the film to be polished like di-plating of the plating electrode. This method was developed for polishing metal, especially Cu interconnect wire. For various reasons, this method has not become the mainstream. [Pg.419]

Electric chemical polish (ECP) and electric chemical mechanical polish (ECMP) [53] have been developed as promising methods for global planarization of LSI fabrication and abrasive-free polish. [Pg.4]

See other pages where Electrical chemical mechanical polish method is mentioned: [Pg.237]    [Pg.246]    [Pg.299]    [Pg.190]    [Pg.190]    [Pg.431]    [Pg.191]    [Pg.382]    [Pg.112]    [Pg.76]   


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Chemical mechanisms

Chemical-mechanical

Electric mechanisms

Electrical chemical mechanical polish

Mechanical methods

Mechanical polishing

Mechanical-Electrical Methods

Polish/polishers

Polisher

Polishes

Polishing mechanisms

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