Ebara polishers

Next, in Figure 15.12, we show removal rate and defect results from a tungsten process run on an F-REX 300 Ebara polisher. The process uses an IC pad and W2000 slurry with a normal flow rate of 250 mL/min. For this process, the PA removal rate declines steeply as the flow rate decreases while the SIS removal rate is nearly constant. The SIS defect count is also about half of the PA count and does not change when the flow rate is halved (Figure 15.12). The nonuniformity and carrier trailing edge peak pad temperature (not shown) were also measured and are the same for both apphcation methods. 

Figure 15.11 Removal rate data for SIS for an Ebara polisher.

Figure 15.12 Removal rate and normalized defect data for a tungsten process on an Ebara polisher.

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