Direct bond copper cross section

When aluminum nitride (AIN) is bonded to copper with the DBC process, the surface of the ceramic first needs to be converted with heat and oxygen to alumina. This results in a thin layer (1-2 /xm) of oxygen-bearing alumina. The cross section of copper direct bonded to AIN is shown in Figure 8.11 [11]. The oxidized AIN is then placed in the furnace with the copper foil in the same maimer as with alumina and beryllium oxide. The process flow for DBC on AIN is shown in Figure 8.12. 

Finally, coupling reactions that occur without a leaving group, a main group metal reagent, or both have been reported. These "direct arylation" reactions are a form of C-H bond activation, typically of aromatic or heteroaromatic C-H bonds. Due to the close relationship between these processes and cross-coupling reactions, however, direct arylations are described in the final section of this chapter after copper-catalyzed coupling processes. 

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